Cleanroom Nanofabrication Facility

TMI’s cleanroom is a 3,000 square feet facility, class 100 used primarily for lithography processes and class 1,000 for fabrication, etching and materials growth, and testing. A wide array of materials deposition tools are available including e-beam and sputtering systems, thermal evaporation systems in gloveboxes, and Langmuir-Blodgett trough. Located in the Faulkner Nanotechnology Building on the 4th floor, the space provides ample room for materials research across a wide range of materials classes.

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AMOD Thermal Deposition System

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Location: FNT 4.106

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AMOD Sputtering

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Location: FNT 4.106

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Vacuum Ovens

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Location: FNT 4.106

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Contact Angle Goniometer

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Location: FNT 4.106

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Cooke e-beam and Sputtering System

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Location: FNT 4.106

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Dektak 6M Stylus Profilometer

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Location: FNT 4.106

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Denton Thermal Evaporator

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Location: FNT 4.106

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Disco 321 Wafer Dicing Saw

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Location: FNT 4.106

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EasyTube 3000 EXT Chemical Vapor Deposition (CVD) System

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Location: FNT 4.106

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Fuljifilm DMP-2800 Dimatix Printer

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Location: FNT 4.106

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J.A. Wollam M2000 Spectroscopic Ellipsometer

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Location: FNT 4.106

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KSV Langmuir-Blodgett Trough

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Location: FNT 4.106

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Laurell Technologies Spincoater I

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Location: FNT 4.106

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Laurell Technologies Spincoater II

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Location: EER 6.626

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March Plasma CS170IF RIE Etching System

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Location: FNT 4.106

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Kurt J Lesker Nano36 Thermal Deposition System

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Location: FNT 4.106

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Oxford Instruments Plasma Lab 80+ PECVD and Etching

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Location: FNT 4.106

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PVD75 e-beam and Sputtering System

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Location: FNT 4.106

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Quorum Technologies Critical Point Drier

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Location: FNT 4.106

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Samco RIE-1C Reactive Ion Etcher

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Location: FNT 4.106

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Suss MA6 Mask Aligner

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Location: FNT 4.106

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West Bond Wire Bonder

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Location: FNT 4.106

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Zeiss Axioscope 2 MAT Optical Microscope

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Location: FNT 4.106

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Zygo Interferometer

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Location: FNT 4.106

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Work Bench for Corporate Users

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Location: FNT 4.106

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Electrical Characterization Instrumentation

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Location: FNT 4.102

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Acids Hood

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Location: FNT 4.106

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HF Hood

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Location: FNT 4.106

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