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PVD75 e-beam and Sputtering System

Contact: Dr. Raluca Gearba
Location: FNT 4.106

Equipment Type:

Cleanroom Instrumentation

Thin Film Fabrication

Information the Equipment Can Provide

The PVD75 thin film deposition system from Kurt J Lesker will enable deposition of metal films and oxides using e-beam, DC and RF sputtering.

System Characteristics:

  • Automated process control using the eKLipse software
  • Graphical recipe builder
  • System base pressure: 5.0E-06 Torr
  • Substrate rotation (up to 20 rpm) and water cooling
  • Pneumatically activated substrate shutter
  • Accommodates a 150 mm substrate
  • Film thickness is monitored using 2 crystal sensors
  • E-beam source: 8 pocket, 12cc sources (source shutter available); the substrate to source distance is about 15 inches
  • Sputtering:
    • 2 DC sputtering sources that can be used also for co-deposition
    • 1 RF sputtering source
    • Typical substrate to source distance is 4 to 6 inches, manually adjustable; low operating pressure
    • Accepts up to 0.375” thick (non-magnetic) targets with a 3″ diameter
    • Low operating pressure capability ≥ 0.5mTorr (material dependent)
    • Tilt capability included
    • Shutters included to limit cross-contamination
    • Up to 4 process gasses available (0 to 20 sccms)

Fees and Policies

  • UT Users: $31/hour
  • Higher Education/State Agencies: $54/hour
  • Corporate/External Users: $46/hour

To become a new user of this facility, please read the Instrument Reservation Information page. If you are already a user you can make a reservation in FBS.

To become a user of this instrument you must first complete the Cleanroom Safety Class. Please contact the facility manager to schedule a training session.