Equipment Type:

Cleanroom Instrumentation

Thin Film Fabrication

Information the Equipment Can Provide

The PVD75 thin film deposition system from Kurt J Lesker will enable deposition of metal films and oxides using e-beam, DC and RF sputtering.

System Characteristics:

• Automated process control using the eKLipse software
• Graphical recipe builder
• System base pressure: 5.0E-06 Torr
• Substrate rotation (up to 20 rpm) and water cooling
• Pneumatically activated substrate shutter
• Accommodates a 150 mm substrate
• Film thickness is monitored using 2 crystal sensors
• E-beam source: 8 pocket, 12cc sources (source shutter available); the substrate to source distance is about 15 inches
• Sputtering:
  • 2 DC sputtering sources that can be used also for co-deposition
  • 1 RF sputtering source
  • Typical substrate to source distance is 4 to 6 inches, manually adjustable; low operating pressure
  • Accepts up to 0.375” thick (non-magnetic) targets with a 3″ diameter
  • Low operating pressure capability ≥ 0.5mTorr (material dependent)
  • Tilt capability included
  • Shutters included to limit cross-contamination
  • Up to 4 process gasses available (0 to 20 sccms)

Fees and Policies

• UT Users: $31/hour
• Higher Education/State Agencies: $54/hour
• Corporate/External Users: $46/hour

To become a new user of this facility, please read the Instrument Reservation Information page. If you are already a user you can make a reservation in FBS.

To become a user of this instrument you must first complete the Cleanroom Safety Class. Please contact the facility manager to schedule a training session.