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Disco 321 Wafer Dicing Saw

Contact: Dr. Raluca Gearba
Location: FNT 4.106

Equipment Type:

Cleanroom Instrumentation

Nano and Micro Fabrication

Information the Equipment Can Provide

The Disco dicing saw is an automatic dicing saw capable of cutting wafers up to 6” diameter. High speed diamond blade produces accurate cuts with minimal chipping. Ultrapure water is flowed onto the blade to keep blade and sample cool during cutting.

Blades offered by TMI:

  • Advanced Dicing Technologies, 00777-V045-011-QKP
  • Hubless, resin bond diamond blades. These blades can be used for cutting silicon, III-V materials as well as quartz or ceramics.
  • Outer diameter: 55.6 mm
  • Inner diameter: 40 mm
  • Blade thickness: 0.011 inches
  • 40-60 grit size

TMI staff can assist users in replacing the blade for one more appropriate to specific processes.

Fees and Policies

  • UT Users: $31/hour
  • Higher Education/State Agencies: $54/hour
  • Corporate/External Users: $46/hour

To become a new user of this facility, please read the Instrument Reservation Information page. If you are already a user you can make a reservation in FBS.

To become a user of this instrument you must first complete the Cleanroom Safety Class. Please contact the facility manager to schedule a training session.