Ph.D. Student Tengfei Jiang Wins Best in Session Award at SRC TECHCON

Ph.D. student Tengfei Jiang recently received the Best in Session Award at Semiconductor Research Corporation’s (SRC) Premier Technical Conference TECHCON for her paper entitled “Microstructure effect on thermal stresses in through-silicon-via (TSV) structures and the implication on the keep-out zone (KOZ).” Tengfei is supervised by Dr. Paul Ho.

The Materials Science & Engineering Program congratulates Tengfei on this achievement.