Equipment Type:

Cleanroom Instrumentation

Metrology

Nano and Micro Fabrication

Plasma Etching and Material Growth

Thin Film Fabrication

Information the Equipment Can Provide

TMI’s cleanroom is a 3,000 square feet facility, class 100 used primarily for lithography processes and class 1,000 for fabrication and testing. Please select any of the links below to learn more about the capabilities of each of the instruments in our cleanroom.

Thin Film Fabrication

• Denton Thermal Evaporator
• Cooke e-beam and Sputtering System
• AMOD Sputtering System
• AMOD Thermal Evaporator (Glovebox System)
• Kurt J Lesker Nano36 Thermal Deposition System
• PVD75 e-beam and Sputtering System
• KSV Langmuir-Blodgett Trough
• Spincoaters (Laurell WS-650 and SCS 6700)

Plasma Etching and Material Growth

• Material growth: EasyTube 3000 EXT Chemical Vapor Deposition (CVD) System for carbon-based materials such as graphene and CNTs
• March Plasma CS170IF RIE Etching System
• Samco RIE-1C Reactive Ion Etcher
• Oxford Instruments Plasma Lab 80+ PECVD and Etching

Lithography

• Suss MA6 Mask Aligner
• Fujifim DMP-2800 Dimatix Printer

Metrology and Inspection

• J.A. Woollam 2000 Spectroscopic Ellipsometer
• Dektak 6M Stylus Profilometer
• Zeiss Axioscope 2MAT Optical Microscope
• Zygo Interferometer
• Contact Angle Goniometer

Other Fabrication Tools

• West Bond Wire Bonder
• Disco 321 Wafer Dicing Saw
• Quorum Technologies Critical Point Drier

Chemical Hoods

• HF Hood: hood dedicated to hydrofluoric acid based processes
• Acids Hood: hood dedicated to Piranha cleaning of substrates
• Photholithography Hood 1: hood equipped with a spincoater (Laurel WS-650) and heating plates
• Photholithography Hood 2: hood equipped with sonicator for substrate cleaning and spincoater (SCS 6700)

A few Vacuum Ovens are also available in TMI’s cleanroom.

The following materials are supplied by TMI for use in the cleanroom.

• BOE CMOS (Buffered Oxide Etch) 6:1.
• Solvents: Acetone, Isopropanol, Methanol, Ethanol.
• Hydrogen Peroxide, 30%.
• Nitric Acid, 70%.
• Sulfuric Acid, 96%.
• Positive Photoresist: S1818 and MF-319 developer.
• Negative Photoresist: SU8 2005 and SU8 developer.
• Image Reversal Photoresist: AZ5209E photoresist and MF-26A developer.
• Hexamethyldisilizane, HMDS

Fees and Policies

• UT Users: $30/hour
• Higher Education/State Agencies: $51/hour
• Corporate/External Users: $65/hour

Access to TMI’s cleanroom will be granted after completion of the Cleanroom Safety Class. Classes are offered weekly. Before attending the class, prospective users must have completed the following:

• A series of safety courses available on EHS website.
  • List of Required Trainings
• Read the Cleanroom Policies and Procedures
• Review the Emergency Procedures for TMI’s Cleanroom

TMI’s cleanroom is available 24/7. Work involving acids are allowed only during working hours, M-F 8 AM to 5 PM. 

The following violations are grounds for cleanroom access removal:

• Not following the Cleanroom Policies and Procedures
• Using an instrument without prior training by a TMI manager
• Accessing the cleanroom by using somebody else’s proximity card. Always use your own card to enter the cleanroom.
• Keeping the door open for another user to enter the cleanroom.

Cleanroom Safety Class Training Fees

• UT Users: $27/hour
• Higher Education/State Agencies: $80/hour
• Corporate/External Users: $80/hour

To become a new user of this facility, please read the Instrument Reservation Information page. If you are already a user you can make a reservation in FBS.