ME 386S 2 – Metallization and Packaging

Course Details
Unique Number18520
Instructor Paul S. Ho
Meeting Days / TimeLecture: TTH, 2:00pm-3:30pm
LocationMER 2.114
Course Description

Technology requirements and trends, impact of device scaling, multilayered interconnect structures, Schottky and ohmic contacts, contact reactions, silicide properties and applications, electromigration, thermal/mechanical properties, reliability.


Mechanical Engineering 386S (Topic 1)