Information the equipment can provide
The Oxford Plasmalab80 is a unique tool which combines etch and deposition capabilities into one tool. The Oxford system can etch high aspect ratio features using either the Bosch (gas chopping) or cryo processes. The system produces very high plasma energies through the use of a remote plasma chamber and an inductively coupled plasma generator, this set-up reduces the need for elaborate precursor development and gives significant control of the impact energy that ions have with the substrate. Depositions of silicon dioxide, silicon nitride, or mixed oxynitrides can be made with the substrate held at room temperature. The plasmalab system gives us the capability to deposit high quality, smooth, pinhole free glass films onto plastic or organic substrates with very little substrate damage. The system can handle wafers up to 8″ in diameter, although the active etch/dep region is the center 4″ of the chamber. Several recipes are available, and recipe development is very straightforward.
Fees & Policies
- Trained On-Campus UT Users: $30/h
- Higher Ed/State Agencies: $54/h
- Corporate Users: $65/h
Facility User Education
To become a user of this instrument please sign up for the next available NT201 and NT211 facility user education classes. External/Corporate users must contact CNM to setup an account before attending facility user education classes.
NT201 Cleanroom Safety Fee: $27.00
NT211 Oxford Fee: $67.00