March Plasma CS170IF RIE Etching System

Reserve Equipment

Information the equipment can provide

The reactive ion etcher is capable of etching oxides, nitrides and III-V semiconductors as well as remove organic contamination from sample surfaces. The unit is outfitted with 4 mass flow controllers for reproducible gas flow. Currently the system is using CF4, SF6, O2, N2, and Ar etch chemistry.

Fees & Policies
  • Trained On-Campus UT Users: $30/h
  • Higher Ed/State Agencies: $54/h
  • Corporate Users: $65/h

Facility User Education

To become a user of this instrument please sign up for the next available NT201 and NT230 facility user education classes.  External/Corporate users must contact CNM to setup an account before attending facility user education classes.

NT201 Cleanroom Safety Fee: $27.00

NT230 Reactive Ion Etcher Fee: $30.00

Location:

FNT 4.106

Contact

Raluca Gearba

Hours & Availability