Disco 321 Wafer Dicing Saw

Reserve Equipment

Information the equipment can provide

The Disco dicing saw is automatic dicing saw capable of cutting wafers up to 6” diameter. High speed diamond blade produces accurate cuts with minimal chipping. Ultrapure water is flowed onto the blade to keep blade and sample cool during cutting.

Fees & Policies
  • Trained On-Campus UT Users: $30/h
  • Higher Ed/State Agencies: $54/h
  • Corporate Users: $65/h

Facility User Education

To become a user of this instrument please sign up for the next available NT201 and NT233 facility user education classes.  External/Corporate users must contact CNM to setup an account before attending facility user education classes.

NT201 Cleanroom Safety Fee: $27.00

NT250 Dicing Saw Fee: $65.00

Location:

FNT 4.106

Contact

Raluca Gearba