Clean Room Facility

TMI’s cleanroom is is a 3,000 square feet facility, class 100 used primarily for lithography processes and class 1,000 for fabrication and testing.

Cleanroom Instrumentation

  • Materials supplied by TMI for Cleanroom Use
    • BOE CMOS (Buffered Oxide Etch) 6:1.
    • Solvents: acetone, isopropanl, methanol, ethanol.
    • Hydrogen peroxide, 30%.
    • Nitric acid, 70%.
    • Sulfuric acid. 96%.
    • Positive photoresist: S1818 and MF-319 developer.
    • Negative photoresist: SU8 2005 and SU8 developer.
    • Image reversal photoresist: AZ5209E photoresist and MF-26A developer.
    • Hexamethyldisilizane, HMDS